ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,650, issued on Sept. 22, was assigned to AaltoSemi Inc. (Nanjing City, China). "Package substrate and fabricating method thereof" was inve... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,651, issued on Sept. 22, was assigned to PHOENIX PIONEER TECHNOLOGY Co. LTD. (Hsinchu County, Taiwan). "Semiconductor package carrier boar... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,652, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,653, issued on Sept. 22, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor device package with flat plate... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,654, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo). "Semiconductor device and power converter" was invented by Hod... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,655, issued on Sept. 22, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device provided with insulating element bonded to in... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,656, issued on Sept. 22. "Power module" was invented by Brice McPherson (Fayetteville, Ark.), Brandon Passmore (Fayetteville, Ark.), Rober... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,657, issued on Sept. 22, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Integration structure fo... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,658, issued on Sept. 22, was assigned to Eliyan Corp. (Santa Clara, Calif.). "Method and apparatus to reduce complexity and cost for multi... Read More
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,659, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package including semiconduc... Read More